Chisom Umunnakwe, M.Sc.

Contact

Tel: 01521 812‑1741 

✉: E-Mail

Field of Research

  • Multiphysics Simulation
  • Research and development
  • Model Order Reduction
  • FEA/FEM Calculation Engineer

Research Project

Mr. Umunnakwe works as a research scientist since February 2021 under the framework of the COMPAS (EU) project supervised by Prof. Dr. -Ing. Tamara Bechtold and Prof. Dr. -Ing. Dennis Hohlfeld. In this project we develop compact modeling techniques for the supply chain of high-tech systems. This very high complexity requires several groundbreaking innovations in the reduction of the model order (MOR) for the CM. Titled: " Model Order Reduction of Coupled Models in Microelectronics ".

Curriculum Vitae

02/2021-12/2023 Research Assistant, Jade Hochschule
10/2019-09/2020 Master of Science Ship Technology, Universität Rostock Germany
09/2018-07/2019 Master of Engineering Mechanical Enginnering, Université de Liège Belgium
10/2011-03/2017 Bachelor of Engineering Mechanical and Marine Enginnering, Niger Delta University Nigeria

 

Publications

Contributions to International Journals (first author) 

  • C.B. Umunnakwe, I. Zawra, M. Niessner, E.B. Rudnyi, D. Hohlfeld, T. Bechtold, “Compact modelling of a thermo-mechanical finite element model of a microelectronic package”, Microelectronics Reliability, vol.151, 2023.

Conference Publications

  • I. Zawra, C.B. Umunnakwe, M. van Soestbergen, E.B. Rudnyi, T. Bechtold, “Stress Recovery in the Reduced Space for Parametric Reduced Models in Microelectronics”, 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), April 2023, Graz, Austria.
  • C.B. Umunnakwe, I. Zawra, E.B. Rudnyi, M. Niessner, T. Bechtold, “Thermo-Mechanical Super-Element of a Packaged-Chip Model for the Reintegration of Reduced State-Space Models into Finite Element Analysis Tools”, 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), April 2023, Graz, Austria.
  • C.B. Umunnakwe, I. Zawra, C. Yuan, E.B. Rudnyi, D. Hohlfeld, M. Niessner, T. Bechtold, “Model Order Reduction of a Thermo-Mechanical Packaged Chip Model for Automotive MOSFET Applications”, 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), April 2022, St Julian, Malta.