• Modern mechatronic components are based on operating principles from different physical domains. They also have complex geometries. Modelling such components at continuum level, i.e. with partial differential equations, is highly complex and requires elaborate numerical solutions. The finite element method, for example, is suitable for this. As soon as the mechatronic components are to be simulated together with the associated control system, the housing or other components, more compact models must be used.

    Mathematical methods of model order reduction offer a possibility to create compact, yet accurate models. With the help of reduced models, system simulations and design optimisations can be carried out much more time-efficiently.

    Members of the research group

    Fachbereich Ingenieurwissenschaften

    Prof. Dr.-Ing. Tamara Bechtold

    E-Mail tamara.bechtold@jade-hs.de

    Phone +49 4421 985-2564

    M.Eng. Arwed Schütz

    E-Mail arwed.schuetz@jade-hs.de

    Phone +49 4421 985-2774

    M.Sc. Siyang Hu

    E-Mail siyang.hu@jade-hs.de

    Phone +49 4421 985-2354

    Ulrike Fitzer

    E-Mail ulrike.fitzer@jade-hs.de

    Patrick Kohaus, M.Eng.

    Friedrich-Paffrath-Straße 101

    26389 Wilhelmshaven

    E-Mail patrick.kohaus@jade-hs.de

    Phone +49 4421 985-2376

    Chu Xu, M.Sc.

    E-Mail chu.xu@jade-hs.de

    Former employees

    Yongchen Rao

    Chisom Umunnakwe

    Chu Xu

    Chengdong Yuan

    Ibrahim Zawra

    Contact

    Fachbereich Ingenieurwissenschaften

    Prof. Dr.-Ing. Tamara Bechtold

    E-Mail tamara.bechtold@jade-hs.de

    Phone +49 4421 985-2564

    Steinbeis Transfer Centre

    Before a technical system is built, its behaviour can be analysed using computer simulations and digital twins. The Steinbeis Transfer Centre for Finite Element Simulation, Model Order Reduction and Optimal Design is pleased to offer this service. We deal with mechanical, thermal, electromagnetic and fluid-dynamic problems. Please contact us to discuss and address your modelling and simulation requirements.

    HPC cooling