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24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

16-19 April 2023

Publikationsdetails

Autor_innen
EuroSimE 2023
Publikationsjahr

2023

Verlag

IEEE

DOI
10.1109/eurosime56861.2023

Matrix Interpolation-Based Parametric Model Order Reduction of Electromagnetic Systems with Translational Movement

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Neuron-Electrode Interface with Hodgkin-Huxley Model in ANSYS

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2023

Stress Recovery in the Reduced Space for Parametric Reduced Models in Microelectronics

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2023

Thermo-Mechanical Super-Element of a Packaged-Chip Model for Re-Integrating Reduced State-Space Models into Finite Element Environment

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2023

Towards System-level Simulation of an Electromagnetic Energy Harvester Model via Equivalent Circuit Extraction from ANSYS Maxwell 3D

Publikationsjahr

2023