Publikationen
- Compact modelling of a thermo-mechanical finite element model of a microelectronic package (2023).
Chisom Umunnakwe,
Ibrahim Zawra,
Martin Nießner,
Evgenii B. Rudnyi,
Dennis Hohlfeld,
Tamara Bechtold.
Erschienen in:
Microelectronics reliability
Elsevier.
- Stress Recovery in the Reduced Space for Parametric Reduced Models in Microelectronics (2023).
Ibrahim Zawra,
Chisom Umunnakwe,
Michiel von Soestbergen,
Tamara Bechtold.
- Thermo-Mechanical Super-Element of a Packaged-Chip Model for Re-Integrating Reduced State-Space Models into Finite Element Environment (2023).
Chisom Umunnakwe,
Ibrahim Zawra,
Evgenii B. Rudnyi,
Martin Nießner,
Tamara Bechtold.
