Abstract
Thermo-mechanical behaviour of microelectronic components, when subjected to thermal cycling, plays a vital role in reliability assessments. This motivates the use of accurate numerical simulation tools. However, numerical simulations are time-consuming and thus, model order reduction methodologies are required. Most literature so far, focuses on single-domain model reduction approaches, that is, the reduction of only thermal or structural domain models. This paper extends existing work to order reduction of coupled linearized thermo-mechanical finite element models. Three thermo-mechanical reduction approaches are studied within the framework of the Krylov-basis reduction technique. This enables the examination of the most efficient approach to reduce the one-way coupled problem. The reduced order model is verified through the comparison with the full order model. The results show that the reduced model significantly decreases the computational costs while providing highly accurate results for temperature and deformation. This paper also emphasizes the potential of model order reduction in enabling system-level simulation of microelectronic components.