• Konferenzband

2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

EuroSimE 2024

Publikationsdetails

Autor_innen
Institute of Electrical and Electronics Engineers (IEEE)
Publikationsjahr

2024

Verlag

IEEE

DOI
10.1109/eurosime60745.2024
ISBN
979-8-3503-9364-4
URL
https://ieeexplore.ieee.org/servlet/opac?punumber=10491281
eISBN
979-8-3503-9363-7

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