• Konferenzpaper

    Model Order Reduction of a Microelectronic Package Subjected to Temperature Cycling and Vibration Test

    Publikationsdetails

    Autoren
    M.Sc. Chengdong Yuan, Martin Nießner, Prof. Dr.-Ing. Tamara Bechtold
    Publikationsjahr

    2024

    DOI
    10.1109/EuroSimE60745.2024.10491409