Model Order Reduction of a Microelectronic Package Subjected to Temperature Cycling and Vibration Test

Publikationsdetails

Autor_innen	Chengdong Yuan, Martin Nießner, Tamara Bechtold
Publikationsjahr	2024
Erschienen in	2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Seiten	1-4
Verlag	IEEE
DOI	10.1109/eurosime60745.2024.10491409