• Konferenzpaper

    Model Order Reduction of a Microelectronic Package Subjected to Temperature Cycling and Vibration Test

    Publikationsdetails

    Autor_innen
    Chengdong Yuan,Martin Nießner,Tamara Bechtold
    Publikationsjahr

    2024

    DOI
    10.1109/eurosime60745.2024.10491409