• Konferenzpaper

    Compact Modelling of Wafer Level Chip-Scale Package via Parametric Model Order Reduction

    Publikationsdetails

    Autoren
    Ibrahim Zawra, Jeroen Zaal, Michiel van Soestbergen, Torsten Hauck, Evgeny Rudnyi, Prof. Dr.-Ing. Tamara Bechtold
    Publikationsjahr

    2024

    DOI
    10.1007/978-3-031-54517-7_25