Compact Modelling of Wafer Level Chip-Scale Package via Parametric Model Order Reduction

Publikationsdetails

Autor_innen	Ibrahim Zawra, Jeroen Zaal, Michiel van Soestbergen, Torsten Hauck, Evgeny Rudnyi, Tamara Bechtold
Publikationsjahr	2024
Erschienen in	Scientific computing in electrical engineering: SCEE 2022, Amsterdam, The Netherlands, July 2022
Seiten	217-228
Verlag	Springer Nature Switzerland
DOI	10.1007/978-3-031-54517-7_25