• Frau Bechtold erhielt ihr Diplom in Mikroelektronik und Mikrosystemtechnik von der Universität Bremen in 2000 und promovierte sich in der Mikrosystem-Simulation an der Universität Freiburg im Jahr 2005. Im Juli 2006 wurde Frau Bechtold mit dem Bertha-Ottenstein-Preis für ihre Dissertation über Modellordnungsreduktion von elektrothermischen MEMS-Modellen ausgezeichnet. Zwischen 2006 und 2010 arbeitete sie als Forschungsingenieurin für Philips Research Laboratories und später NXP Semiconductors in Eindhoven, Niederlande. In den Jahren 2008-2010 war sie Stipendiatin der Robert-Bosch-Stiftung und nahm an dem renommierten Fast Track Coaching Programm teil. Von 2010 bis 2011 arbeitete Frau Bechtold für die CADFEM GmbH in Stuttgart und unterstützte industrielle und akademische Partner bei der Anwendung fortgeschrittener Modellierungs- und Simulationswerkzeuge für multiphysikalische Systemebene. Im Jahr 2011 wurde sie als Vertretungsprofessorin für Mikrosystemsimulation an die Universität Freiburg berufen und seit 2014 fungiert sie als Dozentin und Forschungs-Gruppenleiterin an der Universität Rostock. Frau Bechtold ist seit 2017  Professorin für mechatronische Systeme an der Jade Hochschule in Wilhelmshaven und leitet die Forschungsgruppe für Modellierung und Simulation mechatronischer Systeme.

    Vitae Prof. Dr.-Ing. Tamara Bechtold

    • BMBF Projekt: Erforschung einer digital gestützten Zuverlässigkeitsfreigabe in der Mikroelektronik – MikroVAL, 352.686,00 €    2024 - 2027

      DFG-Projekt: „ADOPT – Adaptive THz Optik“, 241.336 €    2023 - 2026

      DFG-Projekt: Topology Optimization of miniaturized Multi-Resonant systems accelerated by Model Order Reduction (optiMuM), 324.426 €    2021 - 2024

      EU ITEA 3 (EUREKA Cluster) – “COMPAS - Compact modelling of microelectronic products for optimization along the supply chain”, 559.414,80 €    2020 - 2023

      DFG-Projekt: „Kick and Catch – kooperative Mikroaktoren für frei bewegliche Plattformen“, 221.850 €    2020 - 2023

      Finanzierung von fünf Promotionsstipendien im Rahmen des Promotionsprograms Jade2Pro2.0, 380.000 €    2017 - 2027

      Finanzierung des Workshops „MOR 4 MECHATRONICS 2018“ im Rahmen des „European Model Order Reduction Network“ der „European Organization for Cooperation in Science and Technology (COST)“, 10.600 €

    • Numerische multiphysikalische Modellierung auf Komponenten- und Systemebene, z.B. für Mikrosysteme und mechatronische Systeme

      Neue Verfahren zur Beschleunigung der strukturmechanischen Topologieoptimierung

      Anwendung vorgeschrittener mathematischer Methoden der Modellordnungsreduktion und Optimierung auf ingenieurtechnische Fragestellungen

    • Honorary Award in recognition of outstanding contributions to thermal, mechanical, and multiphysics simulation and experimental research in the field of microelectronics and microsystems at the EuroSimE Conference   2026

      Stipendiatin der Robert Bosch Stiftung „Fast-Track“-Programm (5.000 €)   2008 - 2010

      Bertha Ottenstein Preis der Universität Freiburg (5.000 €)   2005

    • Gewähltes Mitglied der Kommission für Forschung, Wissens- und Technologietransfer der Jade Hochschule   seit 2024

      Gewähltes Mitglied des Senats der Jade Hochschule   seit 2023

      Gewähltes stellvertretendes Mitglied des Senats der Jade Hochschule   2021 - 2023

      Gewähltes Vorstandsmitglied beim VDE Nord-West   seit 2017

      Gewähltes Mitglied im akademischen Senat der Universität Rostock   2016 - 2017

    • Patrick Kohaus, „Modellordnungsreduktion für Zuverlässigkeitsuntersuchungen in der Mikroelektronik“, laufende Promotion zum Dr.-Ing.

      Chu Xu, “Simulation-based optimum design for safe and reliable operation of industrial-scale hydrogen electrolyser”, laufende Promotion zum Dr.-Ing.

      Arwed Schütz, “System-Level Simulation of Cooperative Microactuators for Freely Moving Platforms”, laufende Promotion zum Dr.-Ing (Abschluss voraussichtlich 2026).

      Siyang Hu, “Design Optimization of Multimodal Microsystems using Topology Optimization and Model Order Reduction”, laufende Promotion zum Dr.-Ing.

      Dr.-Ing. Yongchen Rao, “Fabrication strategies for high-efficiency thermoelectric generators for electrically active implants”, verteidigt im Juni 2025, Universität Rostock.

      Dr.-Ing. Chengdong Yuan (2024), “Parametric Model Order Reduction of Miniaturized Energy Harvesting Modules”, verteidigt im November 2024, Universität Rostock.

    • “Krylov-Based Thermo-Mechanical Superelements for Efficient Reliability Assessment in Microelectronics”, The 16th international conference on Scientific Computing in Electrical Engineering (SCEE 2026), Lisbon, Portugal, May 2026.  

      Short Course “Efficient Thermo-Mechanical Simulations with Compact Models”, SemiTherm Annual Symposium, San Jose, March 2026.

      Short Course “Efficient Thermo-Mechanical Simulations with Compact Models”, The International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), Anaheim, September 2025.

      Short Course “Efficient Thermal Simulations with Compact Models”, SemiTherm Annual Symposium, San Jose, March 2025.

      Short Course “Efficient Thermal Simulations with Compact Models”, The International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Jose, September 2024.

      Short Course “Efficient Thermo-Mechanical Simulations with Compact Models”, EuroSimE, Utrecht, April 2025.

      Short Course “Efficient Thermal Simulations with Compact Models”, EuroSimE, Gratz, April 2023.

      Short Course „Towards System-Level Modeling and High-Fidelity Simulations of MEMS: Challenges, State-of-the-Art, Perspectives“, Transducers (online), June 2021.

       „Application of Model Order Reduction to Mechatronic Systems“, Oberseminar des Lehrstuhls für Technische Elektrophysik and der Technischen Universität München, Juni 2018.

      „Application of Model Order Reduction to Mechatronic Systems“, Regelungstechnisches Seminar der Technischen Universität München, July 2017.

      „Überblick und Stand der Technik in der Systemsimulation“, 27. Ansys Users Club-Workshop, Dresden, May 2017.

      8th Indo-German Frontiers of Engineering Symposium 2016 (Alexander von Humboldt Foundation), Potsdam, May 2016.

      „System-level modelling of MEMS by means of model order reduction“, BOSCH Corporate Research, Renningen, September 2015.

      “System-level simulation of MEMS by means of model order reduction”, TU Ilmenau, Abendakademie zur System-Simulation von Mikrosystemen, März 2015.

      Seminar at microsystems orientation week, “Microsystems Modelling and Simulation”, Masdar Institute of Science and Technology, Abu Dhabi, August 2013.

      “Efficient System-Level Simulation of Multiphysical Systems”, Workshop on Design and Test Methodologies for Emerging Technologies, 18th IEEE European Test Symposium, Avignon, May 2013.

      Short Course “Model Order Reduction”, EuroSimE, Krakow, April 2013.

      “Reglerentwurf für Werkzeugmaschinen auf Basis von reduzierten Modellen”, Internationales Forum Mechatronik, Cham, September 2011.

      „Effective Electrothermal Simulation for Power Electronics via Model Order Reduction”, 5. Tagung Elektronikkühlung, Stuttgart, May 2011.

      “Determination of Material Thermal Parameters via Model Order Reduction”, ANSYS Conference & 27. CADFEM Users´ Meeting, Leipzig, November 2009.

      “Model order reduction for thermal MEMS-models”, ASME International Mechanical Engineering Congress, Boston, USA, November 2008.

      “Model Order Reduction for Microsystems”, Young Researchers Mini-Symposium, Annual Meeting of the International Association of Applied Mathematics and Mechanics (GAMM), Bremen, March 2008.

      “Linear and Nonlinear Model Order Reduction for Nanoelectronics”, SIAM Conf. on Computational Science and Engineering, CA, USA, February 2007.

      “Model Order Reduction: Challenges towards an advanced, efficient and automated computational tool for microsystems”, Minisymposia on Scientific computing in the electronics industry, The 14th European Conference on Mathematics for Industry (ECMI), Madrid, July 2006.

      “Model Order Reduction for Dynamic Electro-Thermal Simulation of Microsystems”, CASA colloquium, Technical University of Eindhoven, Eindhoven, The Netherlands, December 2005.

    Publikationen

    Prof. Bechtold ist Autorin bzw. Ko-Autorin von über 40 Fachpublikationen auf dem Gebiet der Mikrosystemsimulation. Sie ist Hauptautorin des Springer-Buches  Fast Simulation of Electro-Thermal MEMS: Efficient Dynamic Compact Models, veröffentlicht im Jahr 2006, und die Haupteditorin von “System-Level Modeling of MEMS”, veröffentlicht bei Wiley VHC in 2013.

    Schriftenverzeichnis

    • B. Lohmann, T. Bechtold, P. Eberhard, J. Fehr, D. J. Rixen, M. Cruz Varona, C. Lerch, C. D. Yuan, E. B. Rudnyi, B. Fröhlich, P. Holzwarth, D. Grunert, C. H. Meyer, J. B. Rutzmoser „Model Order Reduction in Mechanical Engineering“ in Model Order Reduction, Berlin, Boston: De Gruyter, 2020. doi.org/10.1515/9783110499001.

      Suleman Shakil, Mikhail Kudryavtsev, Tamara Bechtold, Andreas Greiner, Jan G. Korvink, “Compact Modeling Techniques for Magnetic Resonance Detectors”, in J. Anders, J. G. Korvink (ed.), „Micro and Nano Scale NMR: Technologies and Systems“, Wiley-VCH book series on Advanced Micro and Nanosystems, pp. 21-56, (2018).

      G. Denk, T. Bechtold, M. Culpo, C. de Falco, A. Rusakov, “COMSON Demonstrator Platform”, in M. Guenther (ed.), “Coupled Multiscale Simulation and Optimization in Nanoelectronics”, Springer Verlag, Heidelberg, (ISBN 978-3-662-46671-1), pp. 455-502, (2015).

      T. Bechtold, G. Schrag, L. Feng (eds), “System-Level Modeling of MEMS”, Wiley-VCH Verlag GmbH & Co. KGaA, (ISBN: 3527319034), (2013).

      D. Hohlfeld, T. Bechtold, E. Rudnyi, B. Op het Veld, R. van Schaijk, "Towards system-level simulation of energy harvesting modules" in "System-Level Modeling of MEMS”, Wiley-VCH book series on Advanced Micro and Nanosystems, pp. 313-334, (2013).

      T. Bechtold, D. Hohlfeld, E. B. Rudnyi, J.G. Korvink, "Moment-matching-based linear model order reduction for non-parametric and parametric electro-thermal MEMS models” in "System-Level Modeling of MEMS„ Wiley Book Series on Advanced Micro and Nanosystems, pp. 213-236, (2013).

      T. Bechtold, E. B. Rudnyi, J. G. Korvink, “Model Order Reduction for Electro-Thermal MEMS”, in W.H.A. Schilders and H.A. van der Vorst, (eds), "Model order reduction: theory, research aspects and applications", Springer Verlag, Heidelberg, Series: Mathematics in Industry, pp. 403-420, (ISBN 978-3-540-78840-9), (2008).

      T. Bechtold, E. B. Rudnyi, J. G. Korvink, “Fast Simulation of Electro-Thermal MEMS: Efficient Dynamic Compact Models”, Springer Verlag, Heidelberg, Series: MEMS and Microtechnology, (ISBN 978-3-540-34612-8), (2006).

      1. Yuan, C., Maeter, S., Maniar, Y., Kuttler, S., Wittler, O., and Bechtold, T. "Reduced-Order Modeling for Efficient Reliability Assessment of Package–Board Interactions." ASME. J. Electron. Packag. December 2025; 147(4): 041104. https://doi.org/10.1115/1.4069318 
      2. Hu, S., Manansala, B., Fitzer, U., Hohlfeld, D., & Bechtold, T. (2025). Two-Phase Approach for Fast Topology Optimization of Multi-Resonant MEMS Involving Model Order Reduction. Micromachines, 16(4), 1–24. https://doi.org/10.3390/mi16040401. 
      3. Yongchen Rao, Tamara Bechtold, Dennis Hohlfeld, Design of packaged thermoelectric generators for implantable medical devices: A comprehensive parameter study, Energy, Volume 320, 2025, 134932, https://doi.org/10.1016/j.energy.2025.134932.
      4. Yongchen Rao, Chu Xu, Matthias Voss, Pingjun Ying, Heiko Reith, Kornelius Nielsch, Tamara Bechtold, Dennis Hohlfeld, “Fabrication and Characterization of a Thermoelectric Generator with High Aspect Ratio Thermolegs for Electrically Active Implants”, Advanced Materials Technologies, 9(1), 2024. https://doi.org/10.1002/admt.202470001 
      5. C. B. Umunnakwe, I. Zawra, M. Niessner, E. B. Rudnyi, D. Hohlfeld, T. Bechtold, “Compact modelling of a thermo-mechanical finite element model of a microelectronic package”, Microelectronics Reliability, Vol. 151, 2023. https://doi.org/10.1016/j.microrel.2023.115238 
      6. C. Yuan, A. Schütz, D. Hohlfeld, T. Bechtold, “Towards System-Level Simulation of a Miniature Electromagnetic Energy Harvester Model”, Electronics, vol. 12(15), 2023. https://doi.org/10.3390/electronics12153252 
      7. Schütz, A.; Bechtold, T. Model Order Reduction of Microactuators: Theory and Application. Actuators 2023, 12, 235. https://doi.org/10.3390/act12060235 
      8. Hu, S.; Fitzer, U.; Nguyen, K.C.; Hohlfeld, D.; Korvink, J.G.; Bechtold, T. Multi-Objective Topology Optimization of a Broadband Piezoelectric Energy Harvester. Micromachines 2023, 14, 332. https://doi.org/10.3390/mi14020332
      9. Y. Rao, T. Bechtold, D. Hohlfeld, “Design Optimization of a Packaged Thermoelectric Generator for Electrically Active Implants” Microelectronics Reliability, Vol. 139, 2022, https://doi.org/10.1016/j.microrel.2022.114843
      10.  A. Schütz. S. Maeter, T. Bechtold, “System-Level Modelling and Simulation of a Multiphysical Kick and Catch Actuator System”, Actuators 2021, 10(11), 279; https://doi.org/10.3390/act10110279
      11.  M. Olbrich, A. Schütz, T. Bechtold, C. Ament, “Design and optimal control of a multistable, cooperative microactuator”, Actuators 2021, 10(8), 183; https://doi.org/10.3390/act10080183
      12.  Y. Rao, C. Yuan, G. Sadashivaiah, D. Hohlfeld, T. Bechtold, "Efficient Design Optimization of a Miniaturized Thermoelectric Generator for Electrically Active Implants Based on Parametric Model Order Reduction", International Journal for Numerical Methods in Biomedical Engineering 2021; e3517. https://doi.org/10.1002/cnm.3517
      13.  S. Hu, S. Bouhedma, A. Schütz, S. Stindt, D. Hohlfeld, T. Bechtold, “Design optimization of multi-resonant piezoelectric energy harvesters”, Microelectronics Reliability, 120, 114114, 2021, https://doi.org/10.1016/j.microrel.2021.114114
      14.  A. Schütz, M. Olbrich, S. Hu, C. Ament, T. Bechtold, “Parametric system-level models for position-control of novel electromagnetic free flight microactuator”, Microelectronics Reliability, 119, 114062, 2021, https://doi.org/10.1016/j.microrel.2021.114062
      15.  C. Yuan, D. Hohlfeld, T. Bechtold, “Design optimization of a miniaturized thermoelectric generator via parametric model order reduction”, Microelectronics Reliability, 119, 114075, 2021, https://doi.org/10.1016/j.microrel.2021.114075
      16.  S. Bouhedma, Y. Rao, A. Schütz, C. Yuan, S. Hu, F. Lange, T. Bechtold, D. Hohlfeld, “System-Level Model and Simulation of a Frequency-Tunable Vibration Energy Harvester”, Micromachines, 11(1), 91, 2020; https://doi.org/10.3390/mi11010091
      17.  C. Yuan, S. Kreß, G. Sadashivaiah, E.B. Rudnyi, D. Hohlfeld, T. Bechtold, “Towards Efficient Design Optimization of a Miniaturized Thermoelectric Generator for Electrically Active Implants via Model Order Reduction and Submodeling Technique”, International Journal for Numerical Methods in Biomedical Engineering, vol. 36(4), 2020, https://doi.org/1ra0.1002/cnm.3311 
      18.  Yuan, C., Hu, S. and Bechtold, T., "Stable compact modeling of piezoelectric energy harvester devices", COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, Vol. 39 No. 2, pp. 467-480. https://doi.org/10.1108/COMPEL-07-2019-0305, 2020.
      19.  (invited) S. Hu, C. D. Yuan, A. Castagnotto, B. Lohmann, S. Bouhedma, D. Hohlfeld, T. Bechtold, „Stable Reduced Order Modeling of Piezoelectric Energy Harvesting Modules Using Implicit Schur Complement”, Microelectronics Reliability, 85(2018), pp. 148-155, 2018.
      20.  M. Kudryavtsev, E. B. Rudnyi, J. G. Korvink, D. Hohlfeld, T. Bechtold, “Computationally Efficient and Stable Order Reduction Methods for a Large-Scale Model of MEMS Piezoelectric Energy Harvester”, Microelectronics Reliability, 55(5), pp. 747-757, 2015.
      21.  T. Bechtold, T. Hauck, L. Voss, E. B. Rudnyi, “Efficient Electro-Thermal Simulation of Power Semiconductor Devices via Model order Reduction”, Electronics Cooling, December 2011, pp. 22-27, 2011.
      22.  T. Bechtold, D. Hohlfeld, E. B. Rudnyi, „Efficient extraction of thin film thermal parameters from numerical models via parametric model ordert reduction“, Journal of Micromechanics and Microengineering, 20, pp. 045030, 2010.
      23.  T. Bechtold, M. Striebel, K. Mohaghegh, E. J. W. ter Maten, "Nonlinear Model Order Reduction in Nanoelectronics: Combination of POD and TPWL", PAMM, Proceedings in Applied Mathematics and Mechanics, 8(1), pp. 10057-10060, 2008.
      24.  Verhoeven, T. Voss, P. Astrid, E.J.W. ter Maten, T. Bechtold, "Model order reduction for nonlinear problems in circuit simulation", PAMM, Proceedings in Applied Mathematics and Mechanics, 7(1), pp. 1021603-1021604, 2007.
      25.  T. Bechtold, E. B. Rudnyi, J. G. Korvink, “Dynamic electro-thermal simulation of microsystems – a review”, Journal of Micromechanics and Microengineering, 15, pp. R17-R31, 2005.
      26.  T. Bechtold, E. B. Rudnyi, Markus Graf, Andreas Hierlemann, J. G. Korvink, “Connecting heat transfer macromodels for MEMS array structures”, Journal of Micromechanics and Microengineering, 15(6), pp. 1205-1214, 2005.
      27.  T. Bechtold, E. B. Rudnyi, J. G. Korvink, “Error indicators for fully automatic extraction of heat-transfer macromodels for MEMS”, Journal of Micromechanics and Microengineering, 15(3), pp. 430-440, 2005.
      28.  B. Salimbahrami, B. Lohmann, T. Bechtold, J. G. Korvink, "A two-sided Arnoldi-algorithm with stopping criterion and MIMO selection procedure", Mathematical and Computer Modelling of Dynamical Systems, 11(1), pp. 79-93, 2005.
      29.  J. Hildenbrandt, T. Bechtold, “Microhotplate Gas Sensor”, in Benner, P.,Golub, G., Mehrmann, V., Sorensen, D. (eds) “Dimension Reduction of Large-Scale Systems, Lecture Notes in Computational Science and Engineering (LNCSE)”, Springer-Verlag, Berlin/Heidelberg, 45, 2005.
      30.  D. Hohlfeld, T. Bechtold, “Tunable Optical Filter”, in Benner, P.,Golub, G., Mehrmann, V., Sorensen, D. (eds) “Dimension Reduction of Large-Scale Systems, Lecture Notes in Computational Science and Engineering (LNCSE)”, Springer-Verlag, Berlin/Heidelberg, 45, 2005.
      31.  T. Bechtold, E. B. Rudnyi, J. G. Korvink, “Automatic Generation of Compact Electro-Thermal Models for Semiconductor Devices“, IEICE Transactions on Electronics, E86C, pp. 459-65, 2003.
      1. C. Xu, M. Hanke, D. Hohlfeld, T. Bechztold, “ Subdomain Current Modes and Krylov-based Model Order Reduction for Fast Electromagnetic–Thermal Simulation of High-Current Capacity Conductors”, The 16th international conference on Scientific Computing in Electrical Engineering (SCEE), Mai 2026, Lisbon, Portugal.
      2. S. Hu, N. Wulbusch, A. Chernov, T. Bechtold, „On Model Order Reduction of Free-Field Acoustic Models with a Perfectly Matched Layer“, The 16th international conference on Scientific Computing in Electrical Engineering (SCEE), Mai 2026, Lisbon, Portugal.
      3. S. Hu, D. Hohlfeld, T. Bechtold, “Design Optimization of a Multi-Resonant Folded Beam Piezoelectric Energy Harvester Using an Efficient Two-Phase Topology Optimization”, 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), April 2026, Warsaw, Poland.
      4. M. Keller, T. Bechtold, “A Minimal-Interface Reduced-Order Modeling Approach for Including Convection Effects in Thermomechanical Field Simulation”, 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), April 2026, Warsaw, Poland.
      5. P. Kohaus, S. Dimitrov, A. Schütz, D. Hohlfeld, T. Bechtold, „Numerical Simulation of a Neuron-Electrode Interface in Python and Ansys“, 27th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), April 2026, Warsaw, Poland.
      6. C. Yuan, S. Maeter, S. Kuttler, O. Wittler, T. Bechtold, „Reduced-Order Modelling for Efficient Chip-Package-Board Design“, 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), April 2025, Utrecht, The Netherlands.
      7. T. Janßen, A. Schütz, T. Bechtold, „Numerical Design Study of a Mulistable Electromagnetic Microactuator”, 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), April 2025, Utrecht, The Netherlands.
      8. A. Schütz, M. Olbrich, A. Taghdiri, C. Ament, T. Bechtold „Towards Automated Model Order Reduction and Feedback Control for Nonlinear Finite Element Models” Proc. of 11th Vienna International Conference on Mathematical Modelling (MATHMOD), February 2025
      9. P. Hickisch, J. Saak, D. Hohlfeld, T. Bechtold " Two-step Model Order Reduction for a Thermal Finite Element Model of a Power Electronics Module" Proc. of 11th Vienna International Conference on Mathematical Modelling (MATHMOD), February 2025
      10. S. Hu, N. Wulbusch, A. Chernov and T. Bechtold. "An Error Estimator and Stopping Criterion for Krylov-Based Model Order Reduction in Acoustics." Proc. of 11th Vienna International Conference on Mathematical Modelling (MATHMOD), February 2025.
      11. C. Yuan, S. Maeter, Y. Maniar and T. Bechtold, "Re-Integrating a Reduced-Order Model into Finite Element Environment for Thermo-Mechanical Reliability Analysis in Microelectronics," 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), Berlin, Germany, 2024, pp. 1-6, doi: 10.1109/ESTC60143.2024.10712043 
      12. C. Yuan, S. Maeter, A. Schütz, I. Zawra, M. v. Soestbergen, T. Bechtold, “Efficient Simulation of Nonlinear Plastic Models in Microelectronics: A Trajectory Piecewise Linear-Based Model Order Reduction”, 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), April 2024, Catania, Sicily, Italy.
      13. C. Yuan, M. Niessner, T. Bechtold, “Model Order Reduction of a Microelectronic Package Subjected to Temperature Cycling and Vibration Test”, 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), April 2024, Catania, Sicily, Italy.
      14. Hu S, Manansala B, Bechtold T (2024) Bi-directional Evolutionary Structural Optimization of Multi-Resonant MEMS. In: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, pp 1–5, doi.org/10.1109/EuroSimE60745.2024.10491507
      15. A. Schütz, T. Bechtold, "Model Order Reduction of an Electromagnetic Actuator with Moving Components via Piecewise Quadratic Coupling," 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Catania, Italy, 2024, pp. 1-7, doi: 10.1109/EuroSimE60745.2024.10491476.
      16. U. Fitzer, P. Goyal, A. Schuetz, I. Zawra, D. Hohlfeld and T. Bechtold, "Comparison of Model Order Reduction Methods for a Linear Finite Element Model of an Electrically Stimulated Neuron," 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Catania, Italy, 2024, pp. 1-8, doi: 10.1109/EuroSimE60745.2024.10491473.
      17. A. Schuetz, L. Nolle, T. Bechtold, "Model Order Reduction Augmented by a Neural Network for a Nonlinear Electrostatic Microactuator," ACTUATOR 2024; International Conference and Exhibition on New Actuator Systems and Applications, Wiesbaden, Germany, 2024, pp. 124-127.
      18. Arwed Schütz, Reinhild Roden, Matthias Blau, Steven van de Par, Tamara Bechtold. Highly Efficient Computation of HRTFs by Krylov Subspace-Based Model Order Reduction for Virtual Acoustical Rendering. Forum Acusticum 2023, Sep 2023, Turin, Italy.
      19. C. B. Umunnakwe, I. Zawra, E. B. Rudnyi, M. Niessner, T. Bechtold, “Thermo-Mechanical Super-Element of a Packaged-Chip Model for Re-Integrating Reduced State-Space Models into Finite Element Environment”, Proc. of EuroSimE, 2023, DOI: 10.1109/EuroSimE56861.2023.10100846.
      20. Schütz, A.; Maeter, S.; Bechtold, T. Nonlinear Model Order Reduction of a MEMS Actuator by a Trajectory Piecewise-Linear Approximation. MikroSystemTechnik Kongress; VDE Verlag GmbH: Dresden, 2023; pp 551–554.
      21. (best poster award) I. Zawra, C. B. Umunnakwe, M. van Soestbergen, E. B. Rudnyi, T. Bechtold, “Stress Recovery in the Reduced Space for Parametric Reduced Models in Microelectronics”, Proc. of EuroSimE, DOI: 10.1109/EuroSimE56861.2023.10100787.
      22. (outstanding paper award) A. Schütz and T. Bechtold, "Matrix Interpolation-Based Parametric Model Order Reduction of Electromagnetic Systems with Translational Movement," 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Graz, Austria, 2023, pp. 1-6, doi: 10.1109/EuroSimE56861.2023.10100820
      23. C. Yuan, D. Hohlfeld and T. Bechtold, "Towards System-level Simulation of an Electromagnetic Energy Harvester Model via Equivalent Circuit Extraction from ANSYS Maxwell 3D," 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Graz, Austria, 2023, pp. 1-5, doi: 10.1109/EuroSimE56861.2023.10100816
      24. U. Fitzer, D. Hohlfeld and T. Bechtold, "Neuron-Electrode Interface with Hodgkin-Huxley Model in ANSYS," 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Graz, Austria, 2023, pp. 1-6, doi: 10.1109/EuroSimE56861.2023.10100828
      25. Y. Rao, T. Bechtold and D. Hohlfeld, "Fabrication Strategy for a Thermoelectric Generator with High-aspect-ratio Thermolegs for Electrically Active Implants", EASS 2022, 11th GMM-Symposium, July 2022, Erfurt, Germany.
      26. (best paper award) U. Fitzer, D. Hohlfeld, T. Bechtold, „Reduced Order Model of a Neuron-Electrode Interface Coupled to a Hodgkin-Huxley Model“, Proc. 8th World Congress on Electrical Engineering and Computer Systems and Sciences (EECSS’22), July 2022
      27. Zawra, I., Zaal, J., Soestbergen, M.v., Hauck, T., Rudnyi, E., Bechtold, T. Compact Modelling of Wafer Level Chip-Scale Package via Parametric Model Order Reduction. In: van Beurden, M., Budko, N.V., Ciuprina, G., Schilders, W., Bansal, H., Barbulescu, R. (eds) Scientific Computing in Electrical Engineering. SCEE 2022. Mathematics in Industry(), vol 43. Springer, Cham. doi.org/10.1007/978-3-031-54517-7_25.
      28. S. Hu, U. Fitzer, S. Stindt, T. Bechtold, “Topology Optimization of a Folded Beam Piezoelectric Energy Harvester”, Proc. of 10th Vienna International Conference on Mathematical Modelling (MATHMOD), July 2022.
      29. C. Yuan, S. Hu, T. Bechtold “Stable Parametric Model Order Reduction of Piezoelectric Energy Harvester by Matrix Interpolation” Proc. of 10th Vienna International Conference on Mathematical Modelling (MATHMOD), July 2022.
      30. Schuetz, A., Farny, M., Olbrich, M., Hoffmann, M., Ament, C., & Bechtold, T. (2022, June). Model Order Reduction of a Nonlinear Electromechanical Beam Actuator by Clustering Nonlinearities. In ACTUATOR 2022; International Conference and Exhibition on New Actuator Systems and Applications (pp. 1-4). VDE.
      31. A. Schütz, T. Bechtold, “Performance Comparison for Stable Compact Modelling of Piezoelectric Microactuator”, Proc. 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), April 2022.
      32. C. B. Umunnakwe, I. Zawra, C. Yuan, E. B. Rudnyi, D. Hohlfeld, M. Niessner, T. Bechtold, “Model Order Reduction of a Thermo-Mechanical Packaged Chip Model for automotive MOSFET applications”, Proc. 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), April 2022.
      33. U.Fitzer, D. Hohlfeld, T. Bechtold, “Reduced Order Modelling of a Neuron-Electrode Interface”, Proc. 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), April 2022.
      34. Y. Rao, T. Bechtold, D. Hohlfeld, “Design Optimization of a Packaged Thermoelectric Generator for Electrically Active Implants”, Proc. 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), April 2022.
      35. M. Olbrich, A. Schütz, T. Bechtold, C. Ament, "System-Level Modeling of a Cooperative Microactuator with Free Particle Movement", Proc. Mikrosystemtechnik-Kongress, November 2021
      36. Roy, A., Sadashivaiah, G., Yuan, C., Nabi, M., Bechtold, T. (2021). Modeling of Thermoelectric Generator via Parametric Model Order Reduction Based on Modified Matrix Interpolation. In: van Beurden, M., Budko, N., Schilders, W. (eds) Scientific Computing in Electrical Engineering. Mathematics in Industry(), vol 36. Springer, Cham. https://doi.org/10.1007/978-3-030-84238-3_27
      37. Sadashivaiah, G., Yuan, C., Bechtold, T. (2021). Nonlinear Model Order Reduction of a Thermal Human Torso Model. In: van Beurden, M., Budko, N., Schilders, W. (eds) Scientific Computing in Electrical Engineering. Mathematics in Industry(), vol 36. Springer, Cham. doi.org/10.1007/978-3-030-84238-3_28
      38. S. Hu, S., U. Fitzer, T. Bechtold, "Topology Optimization of Miniaturized Piezoelectric Energy Harvester." Proc. 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), April 2021.
      39. Y. Rao, S. Bouhedma, T. Bechtold and D. Hohlfeld, "Parametric Simulation of a Packaged Thermoelectric Generator for Electrically Active Implants," Proc. 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), April 2021.
      40. C. Yuan, T. Bechtold, 'Geometrically Parametrized Reduced Order Model of a Miniaturized Thermoelectric Generator for Electrically Active Implants', Proc. 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), April 2021.
      41. C.D. Yuan, D. Hohlfeld, T. Bechtold, “Design Optimization of a Miniaturized Thermoelectric Generator”, Proc. 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), July 2020.
      42. A. Schütz, S. Hu, E.B. Rudnyi, T. Bechtold, “Electromagnetic System Level Model of Novel Free Flight Microactuator”, Proc. 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), July 2020.
      43. Y. Rao, S. Bouhedma, C. Yuan, T. Bechtold and D. Hohlfeld, "Towards a System-Level Model of a Tunable Dual-Frequency Piezoelectric Energy Harvester," Proc. 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), July 2020.
      44. S. Hu, A. Schütz, S. Bouhedma, D. Hohlfeld, T. Bechtold, “Design Optimization of a Multi-Resonant Folded Beam Piezoelectric Energy Harvester”, ," Proc. 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), July 2020.
      45. G. Sadashivaiah, C. D. Yuan, T. Bechtold, “Nonlinear Model Order Reduction of a Thermal Human Torso Model”, Proc. of the 13th International conference on Scientific Computing in Electrical Engineering, February 16 - 20, 2020 - Eindhoven, The Netherlands, 2020.
      46. C.D. Yuan, G. Sadashivaiah, S. Kreß, E.B. Rudnyi, T. Bechtold, "A Combination of POD-based Model Order Reduction and Thermal Submodeling for Miniaturized Thermoelectric Generator", Proc. Mikrosystemtechnik-Kongress, October 2019
      47. S. Hu, A. Schütz, T. Bechtold. Designoptimierung eines multiresonanten piezoelektrischen Energy Harvesters in ANSYS mit optiSLang und Statistics on Structures - Proceedings of 37. CADFEM ANSYS SIMULATION CONFERENCE, Kassel, Germany, 16-17 Oct., 2019 (ISBN 978-3-937523-38-5).
      48. C.D. Yuan, G. Sadashivaiah, E.B. Rudnyi and T. Bechtold. “Efficient Design Optimization of a Thermoelectric Generator by a Combination of Model Order Reduction and Thermal Submodeling Techqniues”. In Proc. 33th European Conference on Modeling and Simulation (ECMS) 2019, Caserta, Italy, June 2019.
      49. S. Hu, Z. Liu, T. Bechtold, “Fast Topology Optimization for Resonating Structures via Generalized Incremental Frequency Method and Modal Superposition-Based Model Order Reduction”, Proc. 13th World Congress of Structural and Multidisciplinary Optimization, WCSMO13, 2019.
      50. O. S. Jadhav, E. B. Rudnyi, T. Bechtold, “Load Snapshot Based Nonlinear-Input Model Order Reduction of a Thermal Human Tissue Model”, Proc. of the 12th International Conference on Scientific Computing in Electrical Engineering, September 23-27, Taormina, Sicily, Italy, 2018.
      51. S. Hu, C. Yuan, T. Bechtold, “Quasi-Schur Transformation for the Stable Compact Modeling of Piezoelectric Energy Harvester Devices”, Proc. of the 12th International Conference on Scientific Computing in Electrical Engineering
        September 23-27, Taormina, Sicily, Italy, 2018.
      52. O. S. Jadhav, C. D. Yuan, E. B. Rudnyi, D. Hohlfeld, T. Bechtold, “Nonlinear-Input Model Order Reduction of a Thermoelectric Generator for Electrically Active Implants”, Proc. International Conference on Bioelectromagnetism (ICBEM), May 2018.
      53. C. Yuan, O. S. Jadhav, E. B. Rudnyi, D. Hohlfeld, T. Bechtold , “Parametric Model Order Reduction of a Thermoelectric Generator for Electrically Active Implants”, Proc. EuroSimE, April 2018
      54. C. Yuan, S. Hu, A. Castagnotto, B. Lohmann, T. Bechtold, “Implicit Schur Complement for Model Order Reduction of Second Order Piezoelectric Energy Harvester Model”, Proc. 9th Vienna International Conference on Mathematical Modelling (MATHMOD 2018), Feb. 2018. 
      55. J. Bernhardt, U. Verma, T. Bechtold, D. Hohlfeld, “ Entwurf eines thermoelektrischen Generators für elektrisch aktive Implantate”, ANSYS Conference, November 2017.
      56. O. S. Jadhav, C. Yuan, D. Hohlfeld, T. Bechtold, “Design of a thermoelectric generator for electrical active implants”, Proc. Mikrosystemtechnik-Kongress, pp. 402-405, Oct. 2017.
      57. C. Yuan, E.B. Rudnyi, H. Baumgartl, T. Bechtold, “Model Order Reduction and System Simulation of a Machine Tool for Real-Time Compensation of Thermally Induced Deformations”, Proc. IEEE International Conference on Advanced Intelligent Mechatronics 2017.
      58. T. Bechtold, J. A. Pico Acevedo, D. Hohlfeld, “Compact Model of a Wireless Power Transfer System”, Proc. IEEE WPTC 2017.
      59. J. A. Pico Acevedo, D. Hohlfeld, T. Bechtold, “Model Order Reduction for COMSOL - A Compact Model of a Wireless Power Transfer System”, COMSOL Conference, October 2016.
      60. D. Hohlfeld, D. Hoffmann, T. Bechtold, “Parameter and Topology Optimization of Microstructured Piezoelectric Energy Harvester”, ANSYS Conference, October 2016.
      61. T. Bechtold, D. Hohlfeld, “Air Cooling Simulation of High Performance Computing Platform with Integrated Polymer Waveguides”, ANSYS Conference, October 2016.
      62. (keynote) T. Bechtold, D. Hohlfeld, “Multi-Physical Simulation of High Performance Computing Platform Integrating Polymer Waveguides”, Proc. 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), April 2016.
      63. D. Hoffmann, T. Bechtold, D. Hohlfeld, “Design Optimization of MEMS Piezoelectric Energy Harvester”, accepted for publication at International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), April 2016.
      64. D. Hoffmann, S. Bouhedma, T. Bechtold, D. Hohlfeld, “Entwurfsverfahren für piezoelektrische Energiewandler mit mehreren inhärenten Betriebsfrequenzen”, GMM-Workshop Energieautarke Sensorik, February 2016.
      65. Sh. Gorgi Zadeh, M. Kudryavtsev, M. Jouda, J. G. Korvink, T. Bechtold, “System Level Simulation of Compact Parametric Model of Magnetic Resonance Micro Sensor“, Proc. Mikrosystemtechnik-Kongress, 2015.
      66. (best paper award) M. Kudryavtsev, E. B. Rudnyi, D. Hohlfeld, T. Bechtold, “Computationally Efficient and Stable Order Reduction Methods for a Large-Scale Model of MEMS Piezoelectric Energy Harvester”, ANSYS Conference, June 2015.
      67. M. Kudryavtsev, Sh. Gorgi Zadeh, M. Jouda, J. G. Korvink, T. Bechtold, “System-Level Simulation of Micro Magnetic Resonance Imaging Sensor”, Proc. EUROMAR, pp. 626-627, 2015.
      68. M. Kudryavtsev, J. G. Korvink, T. Bechtold, “A Compact Parametric Model of Magnetic Resonance Micro Sensor”, Proc. EuroSimE, pp. 1-8, 2015.
      69. (keynote) T. Bechtold, G. Schrag, L. Feng, „Enabling Technologies for System-Level Simulation of MEMS“, Proc. 5th Electronics System-Integration Technology Conference, 2014.
      70. M. Kudravtsev, D. Hohlfeld, E. B. Rudnyi, T. Bechtold, J. G. Korvink, „Structure Preserving Model Order Reduction and System Level Simulation of MEMS Piezoelectric Energy Harvester“, Proc. 5th Electronics System-Integration Technology Conference 2014.
      71. M. Kudravtsev, E. B. Rudnyi, T. Bechtold, J. G. Korvink, "Computationally Efficient and Stable Order Reduction Method for a Large-Scale Model of MEMS Piezoelectric Energy Harvester, Proc. EuroSimE 2014.
      72. F. Sayed, D. Hohlfeld, M. Eker, E. Rudnyi, T. Bechtold, J. G. Korvink, “Enabling efficient design of Self-Supplied SSHI circuit for Piezoelectric MEMS Energy Harvester”, Proc. Mikrosystemtechnik-Kongress 2013, pp. 103-106, 2013. 
      73. F.Sayed, D. Hohlfeld, T. Bechtold, J. G. Korvink, “System Level Simulation of a Reduced Order Model for a MEMS Piezoelectric Energy Harvester with a Self-Supplied SECE-Circuit”, Proc. 6th ECCOMAS Conference on Smart Structures and Materials, SMART2013.
      74. (invited keynote) T. Bechtold, G. Schrag, L. Feng, „Enabling Technologies for System-Level Simulation of MEMS“, Proc. EuroSimE 2013.
      75. F.Sayed, T. Aftab, M. Eker, D. Hohlfeld, T. Bechtold, J. G. Korvink, “Reduced Order Modeling Enables System Level Simulation of a MEMS Piezoelectric Energy Harvester with a Self-Supplied SSHI-Scheme”, Proc. EuroSimE 2013.
      76. T. Aftab, D. Hohlfeld, E. B. Rudnyi, T. Bechtold, J. G. Korvink, “New Modelling Approach for Micro Energy Harvesting Systems Based on Model Order Reduction Enabling Truly System-Level”, Proc. 23rd Micromechanics and Microsystems Europe Workshop, September 2012, paper D 06.
      77. D. Hohlfeld, T. Bechtold, E. Rudnyi, R van Schaijk, “System-level simulation and verification of a MEMS-based piezoelectric energy harvesting module”, Proc. Mikrosystemtechnik-Kongress 2011, pp. 972-975, 2011.
      78. M. Rosu, S. Kher, J.-D. Beley, D. Ostergaard, T. Bechtold, R. Rauch, J. Otto, „Fast and efficient multi-domain system simulation based on coupled heterogeneous model structures“,Proc. SPIE 7977, Active and Passive Smart Structures and Integrated Systems 2011, pp. 797722, 2011.
      79. T. Bechtold, D. Hohlfeld, E. B. Rudnyi, “System-Level Model of Electrothermal Microsystem with Temperature Control Circuit”, Proc. EuroSimE 2011.
      80. T. Bechtold, D. Hohlfeld, E. B. Rudnyi, “Efficient Extraction of Thin Film Thermal properties via Parametric Model Order Reduction and Optimization”, Proc. Transducers 2009, Denver, Colorado, USA, pp. 2437-2440, 2009.
      81. T. Bechtold, D. Hohlfeld, E. B. Rudnyi, “Efficient Solution of Inverse Thermal Problem via Parametric Model Order Reduction”, Proc. EuroSimE 2009, Delft, The Netherlands, pp. 101-106, 2009.
      82. J. Ter Maten, A. Verhoeven, M. Striebel, T. Bechtold, “Parametrized Model Order Reduction for Non-Linear IC Models, Proc. ECMI 2008.
      83. Vollebregt, T. Bechtold, A. Verhoeven, J. ter Maten, “Model Order Reduction of Large Scale ODE Systems: MOR for ANSYS versus ROM Workbench”, in G. Ciuprina, D. Ioan (eds), „Scientific Computing in Electrical Engineering SCEE 2006“, Springer-Verlag, Berlin/Heidelberg, 2007.
      84. T. Bechtold, A. Verhoeven, J. ter Maten, T. Voss “Model order reduction: an advanced, efficient and automated computational tool for microsystems”, in V. Cutello, G. Fotia, L. Puccio (eds), „Applied and Industrial Mathematica in Italy“, World Scientific Publishing Co., 2007.
      85. T. Voss, A. Verhoeven, T. Bechtold, J. ter Maten, “Model Order Reduction for Nonline-ar Differential Algebraic Equations in Circuit Simulation”, in L. L. Bonilla, M. Moscoso, G. Platero, J. M. Vega (eds), „Progress in Industrial Mathematics at ECMI 2006“, Springer-Verlag, Berlin/Heidelberg, 2007.
      86. E. B. Rudnyi, C. Moosmann, A. Greiner, T. Bechtold, J. G. Korvink, „Parameter Preserving Model Reduction for MEMS System-level Simulation and Design”, MATHMOD, Vienna, Austria, 2006.
      87. T. Bechtold, E. B. Rudnyi, J. G. Korvink, „mor4ANSYS: Efficient Model Order Reduction of Finite Element Electro-Thermal MEMS Models”, Proc. Mikrosystemtechnik Kongress, pp. 649-652, 2005.
      88. T. Bechtold, D. Hohlfeld, E. B. Rudnyi, H. Zappe, J. G. Korvink, „Inverse Thermal Problem via Model Order Reduction: Determining Material Properties of a Microhotplate”, Proc. International Workshop on THERMAL INVESTIGATIONS of ICs and Systems, Proc. THERMINIC, pp. 146-150, 2005.
      89. M. Salleras, T. Bechtold, L. Fonseca, J. Santander, E. B. Rudnyi, J. G. Korvink, S. Marco, “Comparision of Model Order Reduction Methodologies for Thermal Problems”, Proceedings of 6th International conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, Proc. EuroSimE, pp. 60-65, 2005. 
      90. T. Bechtold, J. Hildenbrand, J. Woellenstein and J. G. Korvink, “Model Order Reduction of 3D Electro-Thermal Model for a Novel Micromachined Hotplate Gas Sensor”. Proc. 5th Int. conf. on thermal and mechanical simulation and experiments in microelectronics and microsystems, Proc. EuroSimE, pp. 263-267, 2004.
      91. T. Bechtold, E. B. Rudnyi and J. G. Korvink, “Error Estimation for Arnoldi-based Model Order Reduction of MEMS”, Technical Proceedings of the 2004 Nanotechnology Conference and Trade Show, Boston, USA, 2004.
      92. T. Bechtold, E. B. Rudnyi, J. G. Korvink and C. Rossi, “Efficient Modelling and Simulation of 3D Electro-Thermal Model for a Pyrotechnical Microthruster”, International Workshop on Micro and Nanotechnology for Power Generation and Energy Conversion Applications, Proc. PowerMEMS, 2003.
      93. T. Bechtold, B. Salimbahrami, E. B. Rudnyi, B. Lohmann and J. G. Korvink, „Krylov-Subspace-Based Order Reduction Methods Applied to Generate Compact Thermo-Electric Models for MEMS“, Proc. Nanotechnology Conference and Trade Show, 2003.
      94. B. Salimbahrami, B. Lohmann, T. Bechtold, J. G. Korvink, "Two-sided Arnoldi Algorithm and Its Application in Order Reduction of MEMS", Proc. Mathmod, pp. 1021-1028, 2003.
      95. T. Bechtold, E. B. Rudnyi, J. G. Korvink, „Automatic Order Reduction of Thermo-Electric Models for MEMS: Arnoldi vs. Guyan“, Proc. Int. Conf. on Advanced Semiconductor Devices and Microsystems, ASDAM, Smolenice, Slovakia, 2002.
      96. T. Bechtold, E. B. Rudnyi, J. G. Korvink, „Automatic Order Reduction of Thermo-Electric Models for Micro-Ignition Unit“, Proc. Int. Conf. on Simulation of Semiconductor Processes and Devices SISPAD, pp. 131-134, 2002.
      97. E. B. Rudnyi, T. Bechtold, J. G. Korvink, C. Rossi, „Solid Propellant Microthruster: Theory of Operation and Modelling Strategy“, Proc. Nanotechnology Conference and Trade Show, Paper 2002-5755, 2002.

    • “Krylov-Based Thermo-Mechanical Superelements for Efficient Reliability Assessment in Microelectronics”, The 16th international conference on Scientific Computing in Electrical Engineering (SCEE 2026), Lisbon, Portugal, May 2026.  

      Short Course “Efficient Thermo-Mechanical Simulations with Compact Models”, SemiTherm Annual Symposium, San Jose, March 2026.

      Short Course “Efficient Thermo-Mechanical Simulations with Compact Models”, The International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), Anaheim, September 2025.

      Short Course “Efficient Thermal Simulations with Compact Models”, SemiTherm Annual Symposium, San Jose, March 2025.

      Short Course “Efficient Thermal Simulations with Compact Models”, The International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Jose, September 2024.

      Short Course “Efficient Thermo-Mechanical Simulations with Compact Models”, EuroSimE, Utrecht, April 2025.

      Short Course “Efficient Thermal Simulations with Compact Models”, EuroSimE, Gratz, April 2023.

      Short Course „Towards System-Level Modeling and High-Fidelity Simulations of MEMS: Challenges, State-of-the-Art, Perspectives“, Transducers (online), June 2021.

       „Application of Model Order Reduction to Mechatronic Systems“, Oberseminar des Lehrstuhls für Technische Elektrophysik and der Technischen Universität München, Juni 2018.

      „Application of Model Order Reduction to Mechatronic Systems“, Regelungstechnisches Seminar der Technischen Universität München, July 2017.

      „Überblick und Stand der Technik in der Systemsimulation“, 27. Ansys Users Club-Workshop, Dresden, May 2017.

      8th Indo-German Frontiers of Engineering Symposium 2016 (Alexander von Humboldt Foundation), Potsdam, May 2016.

      „System-level modelling of MEMS by means of model order reduction“, BOSCH Corporate Research, Renningen, September 2015.

      “System-level simulation of MEMS by means of model order reduction”, TU Ilmenau, Abendakademie zur System-Simulation von Mikrosystemen, März 2015.

      Seminar at microsystems orientation week, “Microsystems Modelling and Simulation”, Masdar Institute of Science and Technology, Abu Dhabi, August 2013.

      “Efficient System-Level Simulation of Multiphysical Systems”, Workshop on Design and Test Methodologies for Emerging Technologies, 18th IEEE European Test Symposium, Avignon, May 2013.

      Short Course “Model Order Reduction”, EuroSimE, Krakow, April 2013.

      “Reglerentwurf für Werkzeugmaschinen auf Basis von reduzierten Modellen”, Internationales Forum Mechatronik, Cham, September 2011.

      „Effective Electrothermal Simulation for Power Electronics via Model Order Reduction”, 5. Tagung Elektronikkühlung, Stuttgart, May 2011.

      “Determination of Material Thermal Parameters via Model Order Reduction”, ANSYS Conference & 27. CADFEM Users´ Meeting, Leipzig, November 2009.

      “Model order reduction for thermal MEMS-models”, ASME International Mechanical Engineering Congress, Boston, USA, November 2008.

      “Model Order Reduction for Microsystems”, Young Researchers Mini-Symposium, Annual Meeting of the International Association of Applied Mathematics and Mechanics (GAMM), Bremen, March 2008.

      “Linear and Nonlinear Model Order Reduction for Nanoelectronics”, SIAM Conf. on Computational Science and Engineering, CA, USA, February 2007.

      “Model Order Reduction: Challenges towards an advanced, efficient and automated computational tool for microsystems”, Minisymposia on Scientific computing in the electronics industry, The 14th European Conference on Mathematics for Industry (ECMI), Madrid, July 2006.

      “Model Order Reduction for Dynamic Electro-Thermal Simulation of Microsystems”, CASA colloquium, Technical University of Eindhoven, Eindhoven, The Netherlands, December 2005.

    Kontakt

    Prof. Dr.-Ing. Tamara Bechtold

    E-Mail tamara.bechtold@jade-hs.de

    Tel. +49 4421 985-2564