Publikationen
- Compact Modelling of Wafer Level Chip-Scale Package via Parametric Model Order Reduction (2024).
Ibrahim Zawra,
Jeroen Zaal,
Michiel van Soestbergen,
Torsten Hauck,
Evgeny Rudnyi,
Tamara Bechtold.
- Comparison of Model Order Reduction Methods for a Linear Finite Element Model of an Electrically Stimulated Neuron (2024).
Ulrike Fitzer,
Pawan Kumar Goyal,
Arwed Schütz,
Ibrahim Zawra,
Dennis Hohlfeld,
Tamara Bechtold.
- Efficient Simulation of Nonlinear Plastic Models in Microelectronics (2024).
Chengdong Yuan,
Sönke Maeter,
Arwed Schütz,
Ibrahim Zawra,
Michiel Van Soestbergen,
Tamara Bechtold.
- Compact modelling of a thermo-mechanical finite element model of a microelectronic package (2023).
Chisom Umunnakwe,
Ibrahim Zawra,
Martin Nießner,
Evgenii B. Rudnyi,
Dennis Hohlfeld,
Tamara Bechtold.
Erschienen in:
Microelectronics reliability
Elsevier.
- Stress Recovery in the Reduced Space for Parametric Reduced Models in Microelectronics (2023).
Ibrahim Zawra,
Chisom Umunnakwe,
Michiel von Soestbergen,
Tamara Bechtold.
- Thermo-Mechanical Super-Element of a Packaged-Chip Model for Re-Integrating Reduced State-Space Models into Finite Element Environment (2023).
Chisom Umunnakwe,
Ibrahim Zawra,
Evgenii B. Rudnyi,
Martin Nießner,
Tamara Bechtold.
Preise
- Bestes Poster (EuroSimE 2026) (2023)
Publikationspreis
- Best Paper Award (EuroSimE 2026) (2026)
Publikationspreis
