Publikationen
- Compact modelling of a thermo-mechanical finite element model of a microelectronic package, Microelectronics reliability, 2023
- Compact Modelling of Wafer Level Chip-Scale Package via Parametric Model Order Reduction
- Comparison of Model Order Reduction Methods for a Linear Finite Element Model of an Electrically Stimulated Neuron
- Efficient Simulation of Nonlinear Plastic Models in Microelectronics
- Stress Recovery in the Reduced Space for Parametric Reduced Models in Microelectronics
- Thermo-Mechanical Super-Element of a Packaged-Chip Model for Re-Integrating Reduced State-Space Models into Finite Element Environment